Big Data & Analytics Innovation Summit
September - , 2017 , Shanghai
Esteban completed his studies at the Australian National University with a Degree in Economics with International Economics Honors and a Degree in Science majoring in Computer Science and Psychology. After this he moved to Germany where he did an Internship in the European Headquarters of IBM in Boeblingen and Stuttgart area. In 1997 Esteban joined ZF Friedrichshafen AG and has since worked in International assignments specializing in IT strategic leadership issues worldwide. Previously based in Shanghai in ZF HQ as Regional CIO with responsibility over 108 ZF Legal Entities in the Asia Pacific Region. Today he is the Global CIO for IOCHPE MAXION a global leader in Automotive Structural components and the World Largest Manufacturer of Steel and Aluminum Wheels. His duties include: - Corporate IT Definition, Development and Deployment (IT DDD) as well as Corporate IT Governance to support IOCHPE-MAXION’s Global Digitalization Strategy focusing on IoT in industry 4.0 leveraging on new and existing Best Practices for the Automotive Industry. - Leading the Due Diligence Process for the strategic acquisitions and Mergers as well as establishing the Integration Process to obtain aggregate value and competitive advantages through ICT. Specialties: Corporate IT Strategy Definition, Development and Deployment (IT DDD), IT Corporate Strategy and governance and business development and integration through IS. Leading the digital transformation through innovation and IT services to enable i4.0 IoT and Big Data Esteban is also a founding member of the China CIO Alliance he is also currently standing as CCAs Chairman for the 2017/2018 cycle after successfully holding the 2016 CCAs VP for Partnerships. The CCA focuses in the exchange of best practices and engaging with Government Technology and Education Industry leaders to collaborate in the definition of the future IT road-map of Multinational Companies in China and Chinese Companies opportunities in the world.